1/4 rev. c structure silicon monolithic integrated circuit product name power supply for ccd camera / white led driver / rgb led driver for mobile phone type bd6025gu features a system power supply for the ccd camera module built-in white led driver and rgb led driver absolute maximum ratings (ta=25 o c) parameter symbol rating unit condition maximum applied voltage 1 vmax1 20(*1) v maximum applied voltage 2 vmax2 16(*2) v maximum applied voltage 3 vmax3 15(*3) v maximum applied voltage 4 vmax4 -13.5(*4) v maximum applied voltage 5 vmax5 6(*5) v power dissipation pd 2413(*6) mw operating temperature range topr -30 to 85 o c storage temperature range tstg -55 to 150 o c (*1) vplus11, vplus12, sbd, sbdsens, vplus 2 pin (*2) camp, camps pin (*3) ledr, ledg, ledb, bkled, fled1 pin (*4) vneg , camn, camns pin (*5) except note1~note4 pin (*6) power dissipation deleting is 19.3mw/ o c, when it?s used in over 25 o c. (it?s deleting is on the board that is rohm?s standard) recommended operating conditions (vbat vio, ta=-30 to 85 o c) parameter symbol rating unit condition min. typ. max. vbat input voltage vbat 2.7 3.6 4.5 v vio input voltage vio 1.62 - 3.3 v this product isn?t designed to protect itself against radioactive rays.
2/4 rev. c electrical characteristics unless otherwise specified, ta=25 o c, vbat=3.6v, vio=1.8v/3.0v, vcc=2.45v parameter symbol spec unit condition min. typ. max. circuit current vbat circuit current 1 iq1 - 0.5 3.0 a rstb=0v vbat circuit current 2 iq2 - 0.1 3.0 a rstb=0v, vio=0v vbat circuit current 3 iq3 - 6.2 9.3 a regvcc on (energy save mode) vbat circuit current 5 iq5 - 11 16 a regvcc on (energy save mode) reg1 on (energy save mode) reg2 on (energy save mode) vbat circuit current 8 iq8 - 17 26 ma regvcc on (nomal mode) swreg1 on (vo=14v, io=1ma) (add 30h=01h, add 80h=01h) regcp on, regcn on swreg1 ( dc/dc for white led and power supply for camera ) fled1 drive current 3 i fled13 27.0 30.0 33.0 ma add=80h data=1eh bkled drive current 3 i bkled3 27.0 30.0 33.0 ma add=90h data=1eh swreg2 ( dc/dc for rgb led ) ledr drive current ( large current) i ledr22 135 150 165 ma add=a0h data=0ch add=50h data=1eh ledg drive current ( large current) i ledg22 135 150 165 ma add=a0h data=0ah add=60h data=1eh ledb drive current ( large current) i ledb22 135 150 165 ma add=a0h data=09h add=70h data=1eh regcp (15v/13v/12v ldo) output voltage 1 vo 151 14.5 15.0 15.5 v io=60ma, vplus12=16v regcpvsel1=0, regcpvsel2=0 output voltage 2 vo 152 12.5 13.0 13.5 v io=60ma, vplus12=15v regcpvsel1=1, regcpvsel2=0 output voltage 3 vo153 11.5 12.0 12.5 v io=60ma, vplus12=15v regcpvsel1=1, regcpvsel2=1 regcn (-8v/-7.5/-7v ldo) output voltage 1 vo81 -8.5 -8.0 -7.5 v io=50ma, vneg=-10v regcnvsel1=0, regcnvsel2=0 output voltage 2 vo82 -8.0 -7.5 -7.0 v io=50ma, vneg=-10v regcnvsel1=1/0, regcnvsel2=1 output voltage 3 vo83 -7.5 -7.0 -6.5 v io=50ma, vneg=-9v regcnvsel1=1, regcnvsel2=0 reg1 (3.0v/3.1v ldo) output voltage 2 vo12 3.04 3.1 3.16 v io=150ma, reg1vsel=1,reg1md=1 reg2 (1.2v/1.8v ldo) output voltage 3 vo22 1.74 1.8 1.86 v io=100ma, reg2vsel=h,reg2md=1
3/4 rev. c external dimensions terminals pin pin name pin pin name pin pin name a1 t1 c9 camps j1 vio a2 gnd2 c10 camp j2 testi a3 vbat1 d1 reg2cnt j3 reg2vsel a4 ledr d2 sensn2 j4 vcc a5 gnd3 d9 testo j5 gnd12 a6 ledb d10 reg2o j6 fled1 a7 camn e1 vbat8 j7 trsw1 a8 vneg e2 testvcc j8 sensp1 a9 gnd6 e9 vbat4 j9 gnd9 a10 t2 e10 vbat3 j10 sbd b1 vplus2 f1 ledctl k1 t4 b2 gnd1 f2 reg1cnt k2 gnd13 b3 vbat2 f9 vref k3 vbat7 b4 trsw2 f10 reg1o k4 bkled b5 ledg g1 rstb k5 gnd11 b6 gnd4 g2 clk k6 vbat6 b7 camns g9 sbdsens k7 gnd10 b8 gnd5 g10 iref k8 vplus11 b9 gnd7 h1 data k9 sensn1 b10 vplus12 h2 strb k10 t3 c1 sensp2 h9 gnd8 - - c2 gnd14 h10 vbat5 - - vcsp85h5 (64pin) (unit : mm) block diagram vio camn camp reg2vsel reg2cnt data strb testi reg1o reg2o vcc trsw1 sensp1 sensn1 reg1cnt bkled fled1 trsw2 led r ledg ledb sensn2 sensp2 vplus2 ledctl vref iref testo vbat1 8 gnd1 14 vneg vplus11 rstb cl k regcp reg1 reg2 regcn cpu i/f cpu i/f sel sel level shift control logic vref iref osc osc + - + - + + - - + - - + - + - + pwm comp current limiter over voltage det err amp swreg2 cpu i/f cpu i/f power supply swreg1 current limiter over voltage det err amp driver driver vplus12 vneg pwm comp testvcc camps camns sbdsens sbd cpu i/f vplus11 vplus12 t1 t2 t3 t4 reference voltage reference current ldo 2.45v clamp ldo ldo 15v/13v/12v ldo -8v/-7.5v/-7v ldo 3.0v/3.1v ldo 1.2v/1.8v lot no. bd6025gu type ( 0.15 ) index post
4/4 rev. c cautions on use (1) absolute maximum ratings an excess in the absolute maximum ratings, such as supply vo ltage, temperature range of operating conditions, etc., can break down devices, thus making impossibl e to identify breaking mode such as a short circuit or an open circuit. if any special mode exceeding the absolute maximum ratings is assum ed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) power supply and gnd line design pcb pattern to provide low impedance for the wiring between the power supply and the gnd lines. pay attention to the interference by common impedance of layout patte rn when there are plural power supplies and gnd lines. especially, when there are gnd pattern for small signal and gnd pattern for large current included the external circuits, please separate each gnd pattern. furthermore, for all power supply terminals to ics, mount a capacitor between the power supply and the gnd terminal. at the same time, in order to use a capacitor, thoroughly check to be sure the characteristics of the capacitor to be used presen t no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (3) gnd voltage make setting of the potential of the gnd terminal so that it will be maintained at the mi nimum in any operating state. furthermore, check to be sure no terminals are at a potentia l lower than the gnd voltage including an actual electric transient. (4) short circuit between terminals and erroneous mounting in order to mount ics on a set pcb, pay thorough attention to the direction and offset of the ics. erroneous mounting can break down the ics. furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or t he gnd terminal, the ics can break down. (5) operation in str ong electromagnetic field be noted that using ics in the strong el ectromagnetic field can malfunction them. (6) input terminals in terms of the construction of ic, parasitic elements are i nevitably formed in relation to potential. the operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. therefore, pay thorough attent ion not to handle the input terminals, such as to apply to the input terminals a voltage lower than the gnd respectively, so that any parasiti c element will operate. furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the ic. in addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (7) external capacitor in order to use a ceramic capacitor as the external capaci tor, determine the constant with consideration given to a degradation in the nominal capacitance due to dc bias and changes in the capacitance due to temperature, etc. (8) thermal shutdown circuit (tsd) this lsi builds in a thermal shutdown (tsd)circuit. a the rmal shutdown circuit works when the junction temperature is beyond detection temperature. then, a part of the lsi or all is made a state of off. the thermal shutdown circuit, which is aimed at isolating the lsi fr om thermal runaway as much as possibl e, is not aimed at the protection or guarantee of the lsi. therefore, do not continuously use the lsi with this circuit operating or use the lsi assuming its operation. (9) thermal design perform thermal design in which there are adequate margin s by taking into account the permissible dissipation (pd) in actual states of use. (10) ldo use each output of ldo by the independence. don?t use under the condition that each output is short-circuited because it has the possibility t hat a operation becomes unstable. (11) dc/dc converter please select the low dcr inductors to decrease power lo ss for dc/dc converter. please choose the external parts not to exceed "maximum ratings" of the coil, the switching transistor, the dio de and the resistance for the electric current detection". (12) other cautions on use please consult supplementary documents such as technical notebook, function manual a nd application notebook of this lsi.
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